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Following is a list of the individual components and their specifications that make up the WINEDS® systems:

 

Components Specifications
PCADC3 PCADC3 PCI bus acquisition card for IBM PC AT compatibles
WINEDS4.0-QL WINEDS4.0 Qualitative Analysis software with acquisition module
WINEDS4.0-QT WINEDS4.0 Quantitative Analysis Software
PX9000 X-ray Pulse Processor with 15, 30 and 60uS time constants, Active Asymmetrical Gated Baseline Restorer, Linear Gate, Pulse Pile up Rejecter, Slow and Fast discriminators.
DX3000 Detector power supply with adjustable HV bias voltage, LN2 sensor support with alarm and HV bias cutoff, HV bias soft start and shutdown, 100 to 240VAC input.
WINEDS-DPP Digital X-ray Pulse Processor with 8 software selectable time constants, digital pulse recognition, pile up rejection and baseline
restoration, PCI based 32 bit bus, field upgradeable firmware.
WINEDS-IM Digital Image Scanning System for acquisition for SEI and BSE images up to 2K x 2K includes Linescan, X-ray Mapping and Point Analysis
capability. Image Enhancement and basic processing software included.
INDIVIDUAL COMPONENT SPECIFICATIONS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Copyright © 2010 Thomson Scientific Instruments Pty Ltd
Last modified: 16 May 2010